Copper bump substrate
Introducing our product lineup, which covers everything from printed circuit board design and manufacturing to component assembly and assembly.
The "Copper Bump Substrate" is a product handled by Arrow Industry Co., Ltd. Our company is capable of creating products that meet customer needs due to our in-house integrated production of printed circuit boards (substrates). Furthermore, we collaborate with local companies to provide services ranging from printed circuit board design and manufacturing to component mounting and assembly. 【Our Features】 ■ In-house integrated production of printed circuit boards (substrates) ■ Collaboration with local companies ■ Services from printed circuit board design and manufacturing to component mounting and assembly ■ Proposals and provision of products tailored to customer needs *For more details, please refer to the PDF materials or feel free to contact us.
- Company：アロー産業
- Price：Other
